Home > News > Content
Tokyo To Host 20th InterMold In April
Feb 15, 2009

The Japan Die & Mold Industry Association is organizing InterMold 2009 (IM2009), the 20th Japan International Die & Mold Technology Exhibition, for April 8–11 at the Tokyo Big Sight exhibition facility. IM2009 will be held in conjunction with Die & Mold Asia 2009 and the Japan Metal Stamping Technology Exhibition 2009.

By co-locating the three trade fairs, the organizer has assembled all processing technologies for die and mould making in one comprehensive show and created a convenient regional meeting place for people and companies involved in die and mould manufacturing in Asia.

In celebration of the 20th anniversary of InterMold, the Japanese industry association has set up the first Mold Grand Prix for students in Japan, China, and South Korea. Competing students will challenge each other’s mould building skills on April 8.

Other event highlights include a special panel discussion to be held on April 9 and workshop-style seminars offered every day by exhibitors introducing their latest products and technologies.

As of January 26, the organizer projected that IM2009, Die & Mold Asia 2009, and Japan Metal Stamping Technology Exhibition 2009 would present 270 exhibitors occupying 830 booths. Anticipated attendance for the four-day event is 65,000.